Bringing an additional layer of fortification to SoCs powering the next trillion connected devices – Arm

Bringing an additional layer of fortification to SoCs powering the next trillion connected devices October 24, 2017 News highlights: Arm announces availability of new on-die technology to protect against attacks seeking to compromise sensitive information through IC power consumption (SPA/DPA) and electromagnetic emission (SEMA/DEMA) Enables simple, scalable, easy to integrate and cost-effective implementation Last year at Arm TechCon, SoftBank Chairman and President Masayoshi Son laid out an ambitious vi

Source: Bringing an additional layer of fortification to SoCs powering the next trillion connected devices – Arm

2017-10-30T15:33:42+00:00